You must be registered to access the full content of this site. To register, click here.
Part Search
Perception Partners with Siemens PLM
Written by Philip Buonpastore
Tuesday, 11 March 2008
AUSTIN, TX - Perception Software has announced an agreement
with Siemens PLM Software to integrate Perception's EDAConnect products with
Siemens PLM Software's Teamcenter product lifecycle management (PLM) software
products.
Perception Software will sell and support
the new software product family, marketed as EDAConnect-Teamcenter. These software products will include: EDAConnect-PCB,
used with systems design tools by Cadence Design Systems, Mentor Graphics,
Zuken, and others, EDAConnect-SiP for
integrating SiP package tools from Cadence, and EDAConnect-ADW for use with
Cadence's Allegro Design Workbench.
"The welcome addition of Perception Software to our
partnership program further expands the ability for our Teamcenter customers to
select from a broad spectrum of high quality solutions," said Steve
Bashada, VP of Teamcenter Applications, Siemens PLM software.
"We think high-tech electronics and semiconductor
customers will be very pleased with the combination of EDAConnect and
Teamcenter," said Joe Dalton, CEO of Perception Software.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com