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Electronica, ProductronicaChina Expand by 30%
Written by Philip Buonpastore
Friday, 07 March 2008
SHANGHAI, CHINA - Electronica & ProductronicaChina, held for the seventh time at the Shanghai New International Expo Center, will increase exhibition space by 30%, according to an industry press release.
Electronica & ProductronicaChina, along with Semicon China and the China Printed Circuit Association (CPCA), are being organized for the first time under the combined Shanghai International IT & Electronics Fair (SIIEF).
SIIEF will occupy 10 halls at the Shanghai New International Expo Center and is the claimed largest electronics event in China, with a reported total exhibition area of more than 1.2 million square feet. The event is also being supported for the first time by the Shanghai Municipal Information Commission, and the Shanghai Pudong New Area People’s Government.
According to industry sources, continuing expansion in the global electronics industry will lead to a 20% growth in the Chinese electronics market in the next few years.
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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