TORONTO -
Celestica Inc. has announced a collaboration with Microsoft on the design of
the BEE3, or Berkeley Emulation Engine 3rd version.
According
to the company, the prototype platform enables emulation of a multi-core
processor environment with at least 1000 cores. Using four interconnecting
field-programmable gate arrays (FPGAs) linked to high-speed interfaces, the
platform can incorporate a single board to 64 boards (256 FPGAs) as needed for
computations, and can be used to perform large-scale research in
areas such as ECAD, scientific computing and computer architecture emulation.
"We
are dedicated to developing new and innovative technologies that will shape the
future computing experience," said Microsoft's Chuck Thacker. "Based on our experience with Celestica, we knew
their engineering talent, experience and CoreSim design tools would help ensure
the successful development of this innovative platform."
Celestica,
who collaborated with Microsoft on the prototypes, was responsible for hardware
specification, schematic capture, layout, signal integrity analysis, static
timing analysis, schematic modeling, design for test and manufacturing.
"We
are excited Microsoft chose to utilize our talent and expertise in design to
develop this innovative technology that could contribute to the future of
computing," said Brian Lau, VP of Celestica. "We have a strong track
record with Microsoft and are proud of our ability to provide a broad range of
services to meet their needs."
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ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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