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Amkor Introduces FusionQuad Packaging |
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Written by Philip Buonpastore
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Friday, 29 February 2008 |
Amkor Technology has announced the introduction of FusionQuad, a package technology designed for budget-conscious thermal performance applications.
FusionQuad is a leadframe-based, plastic package which integrates
bottom lands within a standard QFP package outline. The company claims
that the combination of peripheral leads and bottom lands allows for an
approximate doubling of I/O with an approximate 50% reduction in body
size for an existing lead count. Initial package options range from 100
to 376 I/O, in single and dual row bottom land configurations, and with
sizes ranging from 10 to 24 mm, at 0.8 mm thickness.
www.amkor.com
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