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Flomerics’ MicReD to Play Major Roll in Nanopack Project |
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Written by Philip Buonpastore
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Friday, 29 February 2008 |
MARLBOROUGH, MA – Flomerics’ MicReD subsidiary will play a major roll in the recently announced European-funded Nanopack
project.
The project will address thermal problems that limit performance
increases in semiconductors and power electronics. The company
will reportedly develop technologies and materials for low thermal
resistance interfaces and electrical interconnects.
In order to remove heat from assemblies, low thermal resistance
interfaces need to be incorporated into high-density electrical
interconnects. As an example, power electronics applications in hybrid
vehicles and power supplies are reaching densities that are already
being limited by the inability to transfer heat across interfaces to
liquid coolers and heat sinks.
The Nanopack consortium, which includes MicReD and the Budapest
University of Technology & Economics (BUTE), among others, will
reportedly explore systems such as carbon nanotubes, nanoparticles and
nano-structured surfaces combined with compatible manufacturing
technologies to maximize the beneficial properties of the new materials.
Project results and information will be released through yearly Nanopack workshops. |
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