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Innovasic Introduces Reference Designs and Modules
Written by Philip Buonpastore
Thursday, 28 February 2008
ALBUQUERQUE,
NM - Innovasic Semiconductor has released two new reference designs for its
fido 1100 real-time communications controller family.
The
company reports that PCB modules based on these designs will offer
deterministic real-time response, fail-safe operation and programmable I/O, and can be used for rapid prototyping and
performance evaluation. In addition, the small footprint modules can be directly integrated into customer products.
Two modules
are available, one for embedded real-time Ethernet and one for embedded control
applications.
The
Real-Time Ethernet Module (RTE) reference design includes schematics,
circuit
board layout, bill of materials and software to enable embedded devices
to be
interfaced to a 10/100 Ethernet network. Company information indicates
that packets are received and transmitted with extremely low jitter,
and the fido architecture also allows fail-safe operation, immunity
from
system crashes and denial of service attacks.
The
company has also released Embedded Control Module (ECM) reference design for
the fido1100 which reportedly has programmable I/O, allowing the ECM module to
be with a wide range of serial and parallel interface types, such as UARTs,
GPIO, LCD, SPI, I2C and CAN.
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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