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IPC, Tsinghau University Offer Skills Development Program
Written by Philip Buonpastore
Tuesday, 26 February 2008
BANNOCKBURN, IL - The IPC announced a new initiative with Tsinghua University in Beijing to develop a skills development program for electronics assembly.
The program will be based on IPC-A-610, Acceptability of Electronic Assemblies, IPC/EIA J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC7711/7721, Rework, Modification and Repair of Electronic Assemblies,
and will be offered at approximately 500 vocational schools throughout China.
"The IPC appreciates the opportunity to work with the most prestigious
university in China in preparing tomorrow’s workforce,” said David
Bergman, IPC VP of international relations. “Through the reach of
Tsinghua University, we hope to spread the knowledge of the IPC to
5,000 students annually, educating them on soldering and printed board
assembly quality inspection and promoting standards in advanced
electronics manufacturing technology.”
The skills development program is expected to start later this year.
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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