You must be registered to access the full content of this site. To register, click here.
Part Search
Endicott Interconnect Holds 5th Annual Patent Award Dinner
Written by Philip Buonpastore
Monday, 25 February 2008
ENDICOTT, NY - Endicott Interconnect Technologies, Inc. (EI)
honored 32 employees for patent applications filed, 23 employees for US
patents issued, and 16 employees for supplying trade secrets in a
ceremony held February 8th. EI employees contributed a total of 29 US
patent application filings, 18 US patents issuances and 5 trade secrets
in 2007.
Patents were awarded to: Tim Antesberger, Ash Bhatt, David Caletka,
Varaprasad Calmidi, Norman Card, Rabindra Das, Subahu Desai, Robert
Edwards, Frank Egitto, James Fuller, Robert Japp, John Konrad, John
Kresge, John Lauffer, How Lin, Roy Magnuson, Voya Markovich, Luis
Matienzo, James McNamara, Kostas Papathomas, Steven Rosser, William
Wilson, and Michael Wozniak.
Trade Secrets were awarded to: Norman Card, Benson Chan, Subahu Desai,
Kevin Haughan, Robert Japp, John Konrad, John Kresge, How Lin, Luis
Matienzo, Thomas Miller, Susan Pitely, Rajinder Rai, Ronald Smith,
Duane Stanke, Daniel Van Hart, and Robert Whitehouse.
“The dedication, efforts and achievements of these individuals in the
technology arena are exemplary,” commented James J. McNamara Jr., EI
President and CEO. “Our research, development and engineering
personnel are instrumental to EI by allowing us to meet challenges head
on.”
“I am very proud of the scientists and engineers who have contributed
to the success of EI through technology innovation. They are making a
significant difference in our Company and I congratulate and thank
them,” said Voya Markovich, EI Senior VP and CTO.
The Fifth Annual Patent Recognition Dinner recognizes employees for
their contributions to the company. The team at EI has filed 98 US
patent applications and 48 have been awarded to date.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
News 
