Home arrow News arrow News Archives arrow Fab News arrow Chi Mei Opto to Increase Mainland China Investment
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

Chi Mei Opto to Increase Mainland China Investment Print E-mail
Written by Philip Buonpastore   
Monday, 25 February 2008


TAIPEI - Taiwan-based Chi Mei Optoelectronics announced that it is planning to invest $131 million in mainland China, with $8 million to be spent on increasing capacity in its Ningbo plant, as well as improvements to plants in the Nanhai district of Foshan City that assemble small and medium sized LCMs and touch panels.

The production capacity of the plants in Ningbo and Nanhai are expected to reach 1 and 5 million modules per year by the end of 2008, respectively, an expected capacity increase of 57%.

Chi Mei's latest move is part of its effort to meet the likely rising demand for LCD modules, driven by an expected 45% increase in TFT LCD panel production this year.

Chi Mei is one of several Taiwanese company increasing investment in mainland China. Unitech PCB has also announced plans to invest an additional $20 million into its subsidiary, Shanghai Unitech Electronics Company.
Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising