You must be registered to access the full content of this site. To register, click here.
Part Search
Motorola Unable to Generate Interest in Handset Division
Written by Philip Buonpastore
Friday, 22 February 2008
SCHAUMBURG, IL - Motorola's attempts to sell its handset division to increase value is apparently having the opposite effect.
Three weeks after the company announced that it was considering the
sale or spinoff of its mobile division, no buyer has come forward.
Handset vendors Nokia, Samsung Electronics and LG have all said they're
not interested, and the consumer electronics companies that analysts
had expected to express interest so far haven't. The lack of a sale is
apparently affecting Motorola's stock price, which has dropped 11% in
the last several weeks.
Further problems for a sale may exist in the fact that Motorola also
has government service contracts. Recently, The Committee on Foreign
Investment in the United States (CFIUS), a panel led by the U.S.
Treasury Secretary that reviews corporate deals with foreign buyers,
rejected approval of the sale of 3Com Corp. to China's Huawei Technologies,
causing Huawei to pull their offer.
So according to industry experts, any foreign company from China to the Middle East would likely
think twice before negotiating with a firm such as Motorola with U.S. government
contracts.
Analysts who follow the industry also see the company's mobile division as a
tough sell. "If you take a cool-headed approach to the handset
business, I don't think any major industry player will want it," said
Greg Roh, analyst at Korea Investment & Securities. "A takeover and
ensuing restructuring could be costly and dangerous."
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com