Home arrow News arrow News Archives arrow Design News arrow Broadcom Announces New Platform for HEDGE Smartphones
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

Broadcom Announces New Platform for HEDGE Smartphones Print E-mail
Written by Philip Buonpastore   
Tuesday, 12 February 2008
BARCELONA - Broadcom Corporation has announced a new HEDGE reference design platform for developing next-generation for mass consumer smartphones. The reference design is reportedly based on the company’s 65 nanometer single-chip dual-core HSDPA + EDGE multimedia baseband processor, and integrates several communications functions in a single platform.

According to company information, the new HEDGE reference design platform combines an HSDPA baseband modem that incorporates audio and multimedia processors with a Category 8 HSDPA 7.2 Mbps modem, joining them on a single monolithic chip.  The platform provides support for the three mobile operating systems. Features include the company's Bluetooth, Wi-Fi, GPS and FM radio technology, along with digital image processing that features support for an up to 3.2 megapixel camera. With this integration, the new reference design platform is said to require less board space with lower cost and power usage.

Bringing our various technologies together on a single reference design platform is a strong achievement, made possible by the breadth of our product portfolio and the strength of our engineering capabilities." says Michael Civiello, Senior Director of Marketing.

Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
Mezza-pede Low Profile SMT Connector System
Advanced Interconnections Corporation introduces Mezza-pede, SMT connectors designed for 1 mm-pitch micro board-to-board and flex cable-to-board applications. With a low profile, the screw-machined system is well suited for numerous high reliability applications, such as providing power to tunable lasers.
 
The pin and lead frame design is fully surface mountable, and Mezza-pede has a mated height of 4 mm. Features include screw-machined terminals with multi-finger contacts with a per contact current rating of greater than 1 Amp at 80° C.
 
Mezza-pede comes in standard dual row 8- and 14- position models. Other pin counts and optional enhancements are offered.
 
www.advanced.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising