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Honeywell to Develop Flex Electronics Materials for USDC
Written by Philip Buonpastore
Friday, 25 January 2008
SAN JOSE, CA - Honeywell Electronic Materials and the U.S. Display Consortium (USDC) announced an agreement to develop materials for flexible electronics.
Under this agreement, Honeywell will focus on developing materials to
prevent short circuits in flexible electronics for devices used by the
US military. Beta site testing of these new materials will take place
at the Flexible Display Center at Arizona State University (ASU FDC).
"We continue to find new opportunities to apply our deep knowledge of
materials traditionally used for semiconductors to the growing area of
displays and flexible electronics," said Peter Smith, business director
for Honeywell Specialty Materials. "Besides delivering value and
functionality to the U.S. military, we believe new materials developed
as part of this collaboration will apply to commercial uses."
Honeywell will be developing materials used in flexible displays,
organic light-emitting diodes (OLED) and flexible photovoltaics.
Dr. Mark Hartney, CTO of the US Display Consortium stated, "This
project is important for the development of flexible electronics,
especially displays, where the use of new substrate materials such as
metal foils or plastic films can offer new form factors and potentially
lower costs through new manufacturing methods."
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