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Advanced Photonics Unveils PCB with Embedded Photoelectric Device
Written by Philip Buonpastore
Tuesday, 22 January 2008
Tokyo, Japan - Advanced Photonics, a
venture company from the University of Tokyo specializing in optical
interconnect devices, has succeeded in transmitting signals at 80Gbps (10Gbps x
eight channels) between photoelectric conversion modules installed on a
circuit board.
"This method may be less expensive
than any other technique announced by other companies thus far," said
Makoto Shigematsu, company president.
According to reports, cost reduction can be attributed to fewer components used in its production. The prototype
eliminates the common use of a mirror or lens, by changing position of
the photoelectric conversion modules installed on the board surface.
The company reports that the modules are
installed in a recess on the board. As a result, the waveguide in the
board can be extended vertically from the light receiving/emitting surface
without being curved, eliminating the need for a mirror or lens. This
configuration also allows a higher density of embedded components on the board,
because additional components can be located in place of the eliminated optical parts.
According to
the company, standard equipment is used in the manufacture of the board, with no special
skills required for production.
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