Sunnyvale,
CA - Verdant Electronics announced the addition of three process advisors,
Michael Carano, Bernie Siegal and Henry Utsunomiya.
“I am
truly honored to have these three exceptional individuals join the Verdant
Electronics Board of Advisors,” said Verdant President Joe Fjelstad. “The
addition of these highly respected and talented individuals to the advisory
board will help address technical needs, and drive Occam into a wider range of
new and potential markets,” he added.
The
Occam process is a developing technology for both PCBs and PCBAs, intended to
improve the way electronic products are made. The company claims that the
method simplifies PCB fabrication and assembly, reducing cost and
improving reliability, and that products made with the process will inherently
comply with the EU’s RoHS legislation.
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Are you doing the same thing over and over again and expecting a different result?
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
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