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IPC Releases PCB Studies Print E-mail
Written by Kathy Nargi-Toth   
Friday, 11 January 2008
BANNOCKBURN, IL - IPC — Association Connecting Electronics Industries has released three of its annual North America PCB studies. 
 
2006-2007 Industry Analysis and Forecast for Flexible Circuits in North America is a flexible circuits study covers the North American flexible circuit industry.

2006-2007 Industry Analysis and Forecast for Rigid PCBs and Laminates in North America covers the North American rigid PCB industry. It forecasts growth based on industry end-markets served. It also tracks trends in high-density multilayer boards, production mix trends, and number and value of PCBs and panel produced.

Technology Trends for Printed Circuit Boards for the Year 2006 presents data and analysis on trends in rigid PCB conductor width and spacing, metallic finishes, solder mask usage, multilayer production, laminate thickness and temperature, surface mounting, fine-pitch technology and other leading-edge technologies.
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