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Fifth International Wafer-Level Packaging Conference Set for Oct. 13-16
Written by Philip Buonpastore
Monday, 07 January 2008
SAN JOSE, CA - This year's International Wafer-Level Packaging Conference and Tabletop Exhibition will expand to four days, from October 13 through 16, at the Wyndham Hotel.
This year's conference will include half-day
workshops by Dr. Ken Gilleo, inventor, international lecturer, and
author of seven books on semiconductors, MEMS and nanotechnology trends
and packaging. Dr. Gilleo will reportedly present two workshops
on MEMS and nanotechnology covering aspects of 3D/stacked packaging,
flip chips, testing advanced devices, wafer-level packaging and
emerging technologies, such as the design and fabrication of
through-silicon vias.
Emerging technologies will reportedly also include a workshop on solar
processing and packaging, and a panel discussion on how photovoltaics
will impact the semiconductor and related industries.
The keynote dinner will be held on October 15. Dr. Thomas H. DiStefano,
president of Centipede Systems, whose work at Tessera in San Jose
helped propel chip-scale packaging into the mainstream, will be the
keynote speaker.
The conference will feature more than 50 companies exhibiting and demonstrating their products and services for attendees.
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