Home arrow News arrow Fab News arrow Japan PWB Shipments Up 15% in October
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

Japan PWB Shipments Up 15% in October Print E-mail
Written by Philip Buonpastore   
Wednesday, 26 December 2007
TOKYO -- October shipments of PWBs reached $822 million in Japan, up 15.1% sequentially, the Ministry of Economy, Trade and Industry said.  Shipments totaled 2.28 million sq. meters, up 8.1%. The increase in volume was reportedly not due to any single product, with all markets segments experiencing a rebound. The multi-layer rigid circuit board segment posted significant increases, with four and six to eight layer boards increasing 26.6% and 41.6% respectively compared to the previous month.

Flexible circuits were up 8.3% and module circuits were up 10.1%, however, volume from single-sided flexible circuits remained flat.  Volume from double & multi-layer flexible circuits continued to increase. While volume levels remain high for the rigid module circuit segment, shipments for the past month seemed to show a slight weakness. Shipments for other module circuits remained sluggish during October, but manufacturers report optimism for this segment since demand has turned upward.

Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising