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PCB Austin to Debut in March
Written by Mike Buetow
Tuesday, 18 December 2007
SMYRNA, GA – PCB Austin, a new three-day technical conference, will be held March 4-6, in the Austin suburbs.
The new show, produced by UP Media Group, is located in nearby Round
Rock, 20 minutes from downtown Austin. PCB Austin will include three
days of targeted conference courses from industry experts, one day of
tabletop exhibits, and various networking events.
PCB Austin is an addition to the UPMG portfolio of shows, which
includes PCB East and PCB West. In a statement, President Pete Waddell
said, “We’ve produced the PCB Design Conferences since 1992, but now
see a need to expand our portfolio to include regional events in key
areas throughout North America.”
For more information, visit www.pcbshows.com/austin.
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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