You must be registered to access the full content of this site. To register, click here.
Part Search
Support for Virtual PCB Continues to Grow
Written by Administrator
Thursday, 06 December 2007
ATLANTA – UP Media Group, parent company of Circuits Assembly and Printed Circuit Design & Fab, announced today that support for Virtual PCB, the industry's first virtual trade show and conference for the PCB design, fabrication and assembly markets, continues to grow, as leading industry suppliers sign on to exhibit at the Feb. 12-13 event.
Exhibiting companies to date include Agilent Technologies, Assembléon, ASYS/EKRA, BTU International, Christopher Associates, Dage Precision Industries, DEK, EFD, Kyzen and Siemens Electronics Assembly Systems.
Exhibitors are excited about the new event's potential to access hard-to-reach attendees worldwide. "DEK sees Virtual PCB as a great new way to expand our market reach to the thousands of industry buyers who currently don’t attend trade shows," explained Karen Moore-Watts, global marcom director. "We are excited to be one of the first companies to be part of this groundbreaking event."
According to UP Media Group President Pete Waddell, "These 'early adopters' represent visionary companies who understand how interactive, Web-based events can extend their market reach, as well as complement and enhance the experience of face-to-face events. We look forward to working with these leading-edge suppliers to ensure a successful event."
A fully interactive, Web-based event, Virtual PCB incorporates all the critical features of a live event, while allowing PCB design, fabrication and assembly equipment and materials buyers and sellers to interact online. Supported by a proven software platform, Virtual PCB will be live Feb. 12-13, 2008, and accessible on-demand for three months following the two-day live event.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
News 
