Printed Circuit Design & Fab - Hanzas Elektronika Selects Valor’s vPlan

Home

News

Fab News

Hanzas Elektronika Selects Valor’s vPlan

You must be registered to access the full content of this site.
To register, click here.

Part Search

Hanzas Elektronika Selects Valor’s vPlan

Written by Philip Buonpastore
Wednesday, 28 November 2007
YAVNE, ISRAEL – Hanzas Elektronika has chosen Valor Computerized Systems' vPlan process engineering software. Hanzas will use the tool in its factories in Ogre and Ventspils, Latvia. Financial terms were not disclosed. vPlan synchronizes process engineering, delivering a complete process from CAD to machine, Valor says. vPlan is also said to deliver synchronized manufacturing process definitions to the production floor, while generating machine specific libraries on demand.

[ Back ]

Show (0) - Add comments:

Comments

You are not authorized to leave comments. Please login first.

Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!

Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!

PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds
DFEC Enterprise, Inc. - PCB Sales Representative Process Engineer - Chemical Shure - Project Engineer, PC Board Development Cisco - PCB Sourcing Commodity Manager Danfoss Drives - PCB Designer

New Product

CSP/BallNest Socket Provides Consistant Test and Burn-In

Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.

It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.

It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.

www.arieselec.com