You must be registered to access the full content of this site. To register, click here.
Part Search
Virtual PCB Registration to Open Dec. 7
Written by Administrator
Tuesday, 27 November 2007
ATLANTA – UP Media Group Inc., parent company of Circuits Assembly and Printed Circuit Design & Fab, announced today that online registration for Virtual PCB, the industry's first virtual trade show and conference for the PCB design, fabrication and assembly markets, will open on Dec. 7.
Virtual PCB will be held Feb. 12-13 as a two-day live event that will remain accessible online for three months.
Virtual PCB is free to attend, but online registration is required. Registered attendees will have complete access to all exhibits, technical presentations, lounge areas, the media center and more throughout the entire two-day live event. On-demand attendees will be able to access all recorded/stored event information, but will not be able to participate in live sessions/discussions, real-time Q&A, IM and other unique features of the live event.
All PCB design, fabrication and assembly professionals worldwide are invited and encouraged to register online at www.virtual-pcb.com.
A fully interactive, Web-based event, Virtual PCB incorporates all the critical features of a live event while allowing PCB design, fabrication and assembly equipment and materials buyers and sellers to interact online. Supported by a proven software platform, Virtual PCB will be live for 48 hours Feb. 12-13, and accessible on-demand for three months following the live event.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
News 
