Printed Circuit Design & Fab - iNEMI Kicks-Off 2009 Roadmap

Home

News

Market News

iNEMI Kicks-Off 2009 Roadmap

You must be registered to access the full content of this site.
To register, click here.

Part Search

iNEMI Kicks-Off 2009 Roadmap

Written by Administrator
Thursday, 04 October 2007
HERNDON, VA – The International Electronics Manufacturing Initiative, an industry-led consortium focused on identifying and closing technology gaps, will kick-off its 2009 roadmap in Munich on Nov. 14 at Productronica. This meeting will introduce the new product sector plans for the 2009 Roadmap, review key technology chapters from the 2007 Roadmap, and provide information about the roadmap process cycle for people interested in participating. Preliminary work began on the product sector at a meeting held at IPC Midwest, and the product emulator group kick-off is scheduled for Oct. 12 at SMTAI in Orlando. Chairs of the group will meet with the technical committee and technology working group to identify key changes. For more information about the European kick-off meeting, visit http://www.inemi.org/cms/calendar/2009_RM_European_Kickoff_Nov_07.html. For information about other iNEMI meetings and presentations at Productronica, visit http://www.inemi.org/cms/calendar/Productronica_2007.html.

[ Back ]

Show (0) - Add comments:

Comments

You are not authorized to leave comments. Please login first.

Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!

Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!

PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds
DFEC Enterprise, Inc. - PCB Sales Representative Process Engineer - Chemical Shure - Project Engineer, PC Board Development Cisco - PCB Sourcing Commodity Manager Danfoss Drives - PCB Designer

New Product

CSP/BallNest Socket Provides Consistant Test and Burn-In

Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.

It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.

It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.

www.arieselec.com