You must be registered to access the full content of this site. To register, click here.
Part Search
Samsung Maintains Global TV Lead in Q2
Written by Administrator
Tuesday, 25 September 2007
EL SEGUNDO, CA – Samsung Electronics Co. Ltd. held onto its lead in the global television market in the second quarter, thanks to its strength in LCD-TV shipments, according to iSuppli Corp.
The South Korean electronics giant managed a 12.4% market share in the overall television unit shipments, with fellow Korean firm LG Electronics coming in second with 11.4%, Philips in third with 7.1%, Sanyo in fourth with 6.3% and TCL taking the fifth rank with a 5.6% share, iSuppli says. China’s TCL, the one-time leader, continued to lose ground in the market as shipments slowed, following the end of the New Year’s shopping season.
The overall television market will expand at a CAGR of 4% between 2007 and 2011 for unit shipments, and 5% for revenue. iSuppli forecasts overall global television shipments will grow to 245.5 million units by 2011, up 15% from 2007 and up 22% from 2006.
It isn’t news that CRT-TV units, revenues and average selling prices will decline during the next five years because of a lack of consumer interest, waning OEM production and rising consumer demand for LCD-TVs and other flat-panel sets, iSuppli states.
What is news is that there are still regional markets for CRT TVs, the firm adds.
The Asia/Pacific region is leading the way with 37% of total CRT-TV shipments in the second quarter, following by China with 21% and Europe with 15%. India is becoming the largest market for CRT TVs in the Asia/Pacific region, as slimmer CRTs encourage consumers to buy, says iSuppli.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
News 
