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Intercept Technology Releases High-Speed Design Tool

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Intercept Technology Releases High-Speed Design Tool

Written by Kathy Nargi-Toth
Thursday, 13 September 2007
ATLANTA – Intercept Technology, Inc., partnered with SiSoft to integrate Intercept’s PCB layout software, Pantheon, with SiSoft’s Quantum-SITM product family, allowing users to rapidly determine interface operating margins and achieve High-Speed Timing Closure. This integration will ultimately boost design integrity and time to market for all high-speed designs.

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New Product

CSP/BallNest Socket Provides Consistant Test and Burn-In

Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.

It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.

It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.

www.arieselec.com