Home arrow News arrow Market News arrow Aspocomp’s H1 Sales Down 30% YoY
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

Aspocomp’s H1 Sales Down 30% YoY Print E-mail
Written by Administrator   
Thursday, 09 August 2007
HELSINKI – Circuit board manufacturer Aspocomp reported net sales of $70.6 million for the first half of the year, down 30% year-over-year.
 
This figure includes the divestiture of a Chinese plant in April. Removing the effect of this, comparable net sales declined by 17.6%, says the company.
 
Aspocomp lost $56 million in operating profit for the period. The decline was mostly attributable to write-offs amounting to $27.9 million at its Salo plant, and compensation of $13.8 million to former employees of Aspocomp S.A.S, the company states.
 
Plants in Oulu and China continued to turn a profit, adds Aspocomp.

The company’s investment was $66.7 million in the first half of the year, which consisted mostly in the purchase of a minority share of the Chinese subsidiary.

A decision to close down the Salo plant was made in June, and the plant was closed in July. Net sales of the plant waned because of a limited number of products and production ramp-down, the company says.
Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising