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Cimmetry Releases New AutoVue Tool
Written by Kathy Nargi-Toth
Friday, 20 July 2007
MONTREAL – Cimmetry Systems, a subsidiary of Agile Software Corporation, which was recently acquired by Oracle Corporation, today announced the immediate availability of AutoVue v.19.2. This new EDA centric product offering addresses the requirements of Printed Circuit Board design and contract manufacturing. Several industry leading Electronics and High Tech companies worked in close collaboration with Cimmetry Systems to drive AutoVue’s EDA capability in release 19.2.
"At Harris we work with a variety of high level design tools and require a way to view and collaborate on these documents both internally and externally with our customers and partners. Cimmetry understands our needs, and is working closely with our team to deliver an enterprise visualization solution that will serve the specific requirements of all companies involved in EDA," explains Charlie Davies, Principal ECAE Application Engineer, Harris Corporation, Government Communications Systems Division. "AutoVue 19.2 is a major advancement for viewing, reviewing and collaborating on EDA files, and we are confident it will deliver significant improvements across our enterprise."
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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