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DKN Research and NY Industries Develop Printing Package
Written by Administrator
Wednesday, 18 July 2007
HAVERHILL, MA – DKN Research, an advanced printed circuit engineering firm, and NY Industries Co., Ltd., an Otsu, Japan-based manufacturer of flexible substrates, co-developed a printing process package to produce high-density flexible electronics circuits.
The companies created a series of printing process technologies generating fine traces with micro via holes for functional printable electronics. The process is said to be capable of producing single-side, double-side and multi-layer circuits with embedded passive and active elements.
The process is comparable to copper circuits generated by fine-etching with photolithography. The technologies are capable of printing resistor materials, high-dielectric constant materials and various active materials, including semiconductors.
Anisotropic conductive materials can be printed for connections with other circuits and devices.
The manufacturing process does not use any wet chemicals, so there are no chemical waste byproducts.
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