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Via in Pad White Paper Released

Written by Mike Buetow
Friday, 06 July 2007
CANBY, OR – In the assembly world, putting vias directly in surface mount pads is often not recommended. But for routing large or fine-pitch BGAs, bypass capacitors, thermal management, and grounding on high-frequency parts, via-in-pad can be an effective, if demanding, solution. Just how and when to choose the method is the focus of a new white paper, Via in Pad Guidelines, by Duane Benson of Screaming Circuits. For a copy, visit http://circuitsassembly.com/cms/content/view/5101/187/ or email DBenson@ScreamingCircuits.com.

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