Printed Circuit Design & Fab - Nextreme Releases eTEC Cooler

Home

News

IPC Expo Products

Nextreme Releases eTEC Cooler

You must be registered to access the full content of this site.
To register, click here.

Part Search

Nextreme Releases eTEC Cooler

Written by Administrator
Tuesday, 03 July 2007
eTEC thin film embedded thermoelectric cooler functions as miniature, solid-state heat pump; is ideal for cooling hot spots that result from localized areas of high heat flux on an IC. Operates by Peltier effect. Is designed with compound semiconductor materials that have high electrical conductivity and poor thermal conductivity. Adds 100 µm of height to a heat spreader. Has ms response time. Said to pump a max. heat flux of 150 W/cm2 with some designs delivering as much as 400 W/cm2. Can operate in a high COP regime and pump a heat flux of 50 – 100 W/cm2. Nextreme, www.nextreme.com

[ Back ]

Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!

Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!

PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds
DFEC Enterprise, Inc. - PCB Sales Representative Process Engineer - Chemical Shure - Project Engineer, PC Board Development Cisco - PCB Sourcing Commodity Manager Danfoss Drives - PCB Designer

New Product

CSP/BallNest Socket Provides Consistant Test and Burn-In

Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.

It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.

It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.

www.arieselec.com