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Heat Resistant Polymer Film |
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Written by Administrator
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Tuesday, 26 June 2007 |
APTIV film, for high-end electronics such as high-density flexible circuits, features high temperature performance, chemical wear and hydrolysis resistance, superior mechanical properties, barrier (permeation) and electrical properties. Is high purity, halogen free, and RoHs and FDA compliant. Provides flammability protection without use of flame retardants. Come in widths up to 1.5 meters and thicknesses ranging from six to 750 microns.
Victrex PLC, www.aptivfilms.com
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New Product |
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CSP/BallNest Socket Provides Consistant Test and Burn-In |
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
www.arieselec.com |
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