Home arrow News arrow News Archives arrow Fab News (Archive) arrow XACT PCB and Pluritec Announce Partnership
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

XACT PCB and Pluritec Announce Partnership Print E-mail
Written by Tracy Heffner   
Monday, 21 May 2007
TYNE AND WEAR, England and BUROLO, ItalyXACT PCB and Pluritec Industries have created a strategic partnership for the deployment of Pluritec Advanced Inspecta X-Ray Drill series systems powered by XACT Gemini-X registration control software.

Andrew Kelley, technical director of XACT PCB, said, "Pluritec is a well-respected manufacturer of flexible X-ray drilling systems, which are in use in many of the leading technology PCB shops globally and we are proud to be entering into this partnership. XACT software further enhances Pluritec data capture and provides a solid link back to CAM to form a powerful predictive registration control system."
 
Costanzo D'Angelo, Sales and Marketing director of Pluritec, said, "The XACT linear and non-linear registration control systems are recognized as extremely powerful tools and we are very happy that we can offer these to our high technology customers."

Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising