Home arrow News arrow News Archives arrow Fab News (Archive) arrow Jabil Opening Ho Chi Minh Facility
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

Jabil Opening Ho Chi Minh Facility Print E-mail
Written by Tracy Heffner   
Wednesday, 09 May 2007
ST. PETERSBURG, FLJabil Circuit Inc. has added a facility in Ho Chi Minh City, Vietnam.  Located in Saigon Hi-Tech Park, the 55,000 square-foot facility (expandable to 120,000 square feet) is scheduled to be operational in June 2007. According to the company, the initial investment will be modest but Jabil expects the location to grow in importance over time. 

Jabil's Regional President for Asia, Bill Muir said, "We are developing Vietnam as a production-for-export location. Vietnam offers a globally competitive cost base, a strong workforce and provides good balance to our Asia footprint. Jabil is a strategic partner to some of the world's most trusted brands and it is our role to anticipate and deliver solutions to meet customers' business needs and priorities. Long term, we believe Vietnam will be an integral part of our customers global supply chain."

Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising