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Simberian Releases Simbeor 2007 |
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Written by Tracy Heffner
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Monday, 30 April 2007 |
SEATTLE, WA – Simberian Inc., a developer of electromagnetic software for high-speed and high frequency electronic design automation, has released Simbeor 2007, which is said to allow system designers to accurately generate in minutes transmission lines and via holes models for data rates of 100Gbs and faster.
Simbeor 2007 is a fully integrated graphical simulation environment with built-in 3D full-wave field solver for multilayered circuits (3DML solver). The solver accounts for losses and dispersion from transitions to skin effect, skin and proximity effects, and metal surface roughness. Simbeor 2007 uses broadband causal dielectric models and accounts for high-frequency dispersion in multilayered dielectrics while extracting causal RLGC per unit length and S-parameter models. It reportedly produces advanced full wave models of interconnects for accurate high-speed channel analysis.
Due in large part to the high costs of ownership, 3D full wave solvers have not been an option for most companies previously. Simbeor 2007 with Level 1 features is being released to compliment static and general-purpose electromagnetic solvers currently available.
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New Product |
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CSP/BallNest Socket Provides Consistant Test and Burn-In |
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
www.arieselec.com |
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