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Fidus Reports Record Revenues, Strong Growth
Written by Tracy Heffner
Monday, 30 April 2007
OTTAWA, Ontario, Canada – Fidus Systems has posted revenues of $5.86 million for the year, a five-year high for the company, a news release stated. Revenues rose 29% over the previous year, and 89% over three years.
For the second consecutive year, Fidus ranks as one of Ottawa’s fastest growing companies, according to a survey by independent business analysts with the Ottawa Business Journal. “We’ve undergone rapid expansion at multiple sites,” said President Michael Wakim. “In the past year, we’ve opened a design center in Toronto, added designers in Lebanon and Ottawa, and nearly doubled the size of our Ottawa hardware laboratory.”
U.S.-based customers represented 30% of Fidus’ new contract bookings in 2006, up significantly from the previous year.
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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