Home arrow News arrow IPC Expo Products arrow Taconic to Display Multilayer Capability at MTT-S IMS 2007
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

Taconic to Display Multilayer Capability at MTT-S IMS 2007 Print E-mail
Written by Tracy Heffner   
Tuesday, 24 April 2007
PETERSBURGH, NYThe Advanced Dielectric Division of Taconic will feature a variety of products that offer low loss and high reliability for conventional and multilayer RF and high speed digital board fabrication at the MTT-S International Microwave Symposium in Honolulu, HI June 5 – 7. 
 
Taconic’s TacPreg prepregs, constructed with BT epoxy/woven fiberglass/PTFE components, are said to offer reduced electrical loss and ease of fabrication for high-speed digital and RF commercial and military applications. These dimensionally stable laminates, available with a Dk of 3.00 – 3.5, reportedly enable production of 20+ layer boards at FR-4 laminating temperatures and pressures.
 
According to the company, HyRelex thin flexible interconnect materials offer exceptional thermal, mechanical, electrical and moisture resistant properties for multilayer, double sided and rigid flex circuits. Taconic reports that low dissipation factor, excellent peel strength and smooth surface profile make HyRelex ideal for applications involving high frequencies, high temperatures and harsh environments.
 
TSM-30, designed for consistent performance over broad temperatures and frequencies, offers the unique properties of both low loss and low moisture, and solvent absorption.
 
For heat dissipation in multilayer boards, Taconic’s heavy metal clad laminates provide thick layers of copper, brass and aluminum for reliability in temperature management.
 


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising