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LPKF Releases ProtoLaser 200 |
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Written by Tracy Heffner
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Tuesday, 24 April 2007 |
WILSONVILLE, OR – LPKF Laser & Electronics introduced the new ProtoLaser 200, a laser system for prototyping and on-demand production of PCBs. This fully enclosed laser-based system works directly off of CAD data to produce circuits on a variety of materials including ceramic and PTFE based substrates. The protective cabinet is said to allow for a Class One laser safety rating and prevents any particles or evaporation from leaving the work area.
The ProtoLaser 200 reportedly combines advanced laser technology, optics and x/y table mechanisms, resulting in enhanced quality, speed and accuracy. The said improved performance and speed of this system makes it an ideal component in any RF and microwave engineering environment including antennas, RFID, filters and single layer components.
A visible laser image is projected on to the work surface, outlining the preferred work area, prior to the actual laser structuring, while alignment of two-sided artwork is automated with a fiducial recognition camera. This vision system also allows the ProtoLaser 200 to automatically set the proper laser focal point, visually inspect, and properly align the work piece.
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New Product |
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CSP/BallNest Socket Provides Consistant Test and Burn-In |
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
www.arieselec.com |
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