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Speeding Edge Releases Volume Two of High-Speed PCB and System Design Handbook |
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Written by Tracy Heffner
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Wednesday, 11 April 2007 |
GLEN ELLEN, CA – Speeding Edge released the second volume of its handbook, “Right the First Time, A Practical Handbook on High Speed PCB and System Design.” While the first volume of the handbook addressed the fundamentals of high-speed design, Volume Two provides a detailed explanation of the steps necessary to design and manufacture a high-speed PCB that works right the first time.
Lee Ritchey, founder and president of Speeding Edge, said, “Our goal with this book is to provide a hands-on guide that enables engineering professionals and business decision makers to arrive at critical decisions about the design and fabrication of printed circuit boards that not only work right the first time but are also built with the most cost-effective and time efficient methodologies possible. To that end, we have included an extremely detailed description of the PCB fabrication process; how to select the right PCB materials; the process of understanding and controlling EMI and the various types of glass styles and their impact on board impedance.”
Specific topic highlights of the handbook include:
- Simulation methodologies and toolsets
- A complete description of various PCB structures and their influence on signal integrity
- The build-up fabrication process
- Bare and assembled board testing
- Split planes and return currents
- The virtual prototyping process and the tools used in that process
- A detailed PCB fabrication specification
- Power system tests
- Comprehensive laminate data for high-speed applications
“Right the First Time, A Practical Handbook on High Speed PCB and System Design, Volume 2,” is available for immediate purchase and will be shipped to customers by the end of April.
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New Product |
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CSP/BallNest Socket Provides Consistant Test and Burn-In |
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
www.arieselec.com |
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