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IPC Releases 2006-2007 International Technology Roadmap for Electronic Interconnections
Written by Tracy Heffner
Monday, 09 April 2007
BANNOCKBURN, IL – IPC, Association Connecting Electronics Industries, has released the “2006–2007 IPC International Technology Roadmap for Electronic Interconnections.” Published every two years, the IPC Roadmap provides vision and direction for product and process development and services to satisfy the informational needs of companies manufacturing substrates and assemblies.
“Unlike other roadmaps, the IPC International Technology Roadmap is the only one that exclusively focuses on the printed circuit board and electronics assembly industries,” said Dieter Bergman, IPC’s director of technology transfer. “While a view from 20,000 feet can provide a valuable, broad brush of information, IPC’s Roadmap is purposely designed to provide meaningful insight at an operational level – so companies gain acute understanding for virtually every operation on the manufacturing floor.”
The roadmap is available as a free download to IPC members at www.ipc.org/membersonly. It can be purchased by non-IPC members in a CD format for $250. The CD can also be purchased by members for $125.
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