With 25 years experience in the printed circuit board and substrate fabrication industries, Whitehouse has held senior engineering management positions with companies such as Epec LLC, Sanmina-SCI / Hadco, United Technologies Corp., Digital Equipment Corp. and Texas Instruments. He has military experience and holds a BS from North Georgia College.
“Bob has a strong track record developing engineering organizations, processes and managing resources to create world-class products,” said James Fuller, vice president and general manager, PCB and Semiconductor Packaging at EI. “His expertise in new product and advanced technology development will contribute to our product definition. Along with that, his strengths in tactical operations will lead to yield improvement, cost reduction and capital equipment installation and certification, which is an excellent fit for the type of development we are doing at EI.”
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PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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