Home arrow News arrow Market News arrow RBP Chemical Names Thailand Distributor
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

RBP Chemical Names Thailand Distributor Print E-mail
Written by Tracy Heffner   
Wednesday, 04 April 2007
MILWAUKEE – RBP Chemical Technology has named Pata Chemicals and Machinery Co. Ltd. from Bangkok as distributor of the RBP line of electronic products to the Thailand printed circuit board industry. The blending division of Pata Chemicals and Machinery – Poly Hitech Co. Ltd. – a manufacturer of chemical solutions for the printed circuit fabrication and metal finishing industries, has been licensed to manufacture the complete RBP line of proprietary chemicals for use in Thailand.


RBP Chemical Technology President Mark Kannenberg said, “We have worked with Pata for several years and are very impressed with the quality of their personnel and their commitment to the success of their customers in Thailand. Together, Pata and RBP can bring significant value to Thai printed circuit board fabricators in the years ahead.”
 
Production of DES and SES products began in the first quarter of 2007, with intentions to supply the entire RBP product line from the facility in the near future. 
Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
 
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
 
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
 
www.arieselec.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising