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Tridak Releases Precision Dispense Valve |
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Written by Tracy Heffner
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Tuesday, 03 April 2007 |
DANBURY, CT – Tridak Inc.'s 775 dispense valve is used to precisely deposit accurate amounts of all flowable materials. The valve is said to feature precise, easily adjusted, control over both the rate the material flows and the amount material that is sucked back at the end of a dispense cycle. Both of the flow and suck back controls incorporate a locking device that prevents any unwanted changes.
The air operated 775 valve is reportedly particularly effective for dispensing difficult, stringy materials. It is available with either an aluminum body that has a PTFE impregnated hard-anodized finish or an all stainless body. The self-adjusting seals are available in either a fluoroelastomer or PTFE. The shape of the valve, it’s mounting configuration and the location and operation of the controls have been specifically deigned to allow the valve to be easily integrated into both automated machinery as well as simple workstations. Accessories available for this valve include standard and custom nozzles, nozzle arrays, spray heads and digital valve controllers.
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New Product |
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CSP/BallNest Socket Provides Consistant Test and Burn-In |
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.
It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.
It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.
www.arieselec.com |
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