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PCB Design Conference East 2007 Issues Call for Abstracts
Written by Tracy Heffner
Tuesday, 26 December 2006
ATLANTA –UP Media Group Inc. (UPMG) is seeking abstracts for PCB Design Conference East 2007, to be held Oct. 21-26, 2007, outside Research Triangle Park, NC.
PCB East annually provides attendees and vendors with the premier East Coast conference and exhibition for the design and manufacture of PCBs, high density interconnect (HDI) and other advanced circuits. The event is sponsored by Printed Circuit Design & Manufacture and Circuits Assembly magazines.
The five-day conference program focuses on PCB design, engineering and manufacturing. The conference is comprised of a three-day Technical Conference and a Professional Development Certificate program of one-day and two-day courses.
PCB East 2007 also includes a two-day (Oct. 23-24) exhibition of top industry vendors.
Papers and presentations of the following durations are sought for the Technical Conference: 30-minute paper sessions, one-hour lectures or panel sessions, two-hour workshops, and half-day (3.5 hour) seminars. Papers and presentations also are sought for a Professional Development Certificate program of in-depth, one-day and two-day technical tutorials.
For consideration, please email a course title, suggested course length, short description of the target audience ("who should attend"), 100- to 300-word abstract and speaker bio(s) to Kathy Nargi-Toth (knargitoth@upmediagroup.com) by Feb. 5, 2007.
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology rather than on a company’s specific products.
If selected for PCB East 2007, final papers and presentations will be due in April 2007. Technical conference papers and presentations are published in the conference proceedings and distributed to all conference attendees, exhibitors and speakers. (Submissions selected for the Professional Development Certificate program are not included in the proceedings.) Each speaker/presenter will receive a copy of the technical conference proceedings CD-ROM, a complimentary pass for the three-day technical conference, and complimentary admission to the two-day exhibition, and other special events.
Suggested paper and presentation topics include (but are not limited to):
High-speed, high-frequency and signal integrity
Component placement
EMI/EMC analysis
Thermal analysis
Lead-free processes (especially how they affect design and fabrication)
RF and microwave design
Packaging design
Mixed-signal design
Area arrays
FPGA design and implementation
Embedded passives and active devices
Flexible circuitry
HDI design and technologies
PCB design/layout basics
Component library creation and management
Design for manufacture, test and assembly
Design (including analog, digital and power supplies)
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