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Mentor HyperLynx 7.5 Focuses on SERDES
Written by Tracy Heffner
Monday, 15 August 2005
WILSONVILLE, OR – Mentor Graphics Corp. has released HyperLynx 7.5, the latest version of its tool suite for pre- and post-layout signal integrity (SI) simulation and analysis. HyperLynx 7.5 reportedly includes significant productivity and technology enhancements targeted at emerging SERDES interconnect standards such as PCI-Express, Hyper Transport, XAUI and SATA/SAS.
Version 7.5 also includes Mentor ‘s "Via Visualizer" technology to assist with detailed analysis of vias on a PCB. Other enhancements consist of batch simulation, user interface improvements, additional SERDES eye masks, SPICE modeling enhancements, over 13,000 additional IBIS models, and a "free-form" transmission-line schematic editor for pre-layout what-if exploration and design constraint development.
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Development Kit Test Drives Innovative Cable Assemblies
3M introduces the Shielded Controlled Impedance (SCI) Cable Assembly Development Kit, 2mm. The development kit enables users to assess, test and design high-performance, 2mm SCI cable-to-board solutions. Engineers can attain multi-gigahertz performance from 2 mm printed circuit board connectors using 2mm shielded controlled impedance cable assemblies. The SCI connectors save board space without affecting performance. Users can verify signal integrity, impedance matching and crosstalk performance for designs requiring up to 1 Gbps single-ended performance per signal line or 5 Gbps differential performance per signal pair. The kit contains everything needed to assess, test and design, including a CD-ROM with application note, test instruction and technical sheets. www.3m.com
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