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Ansoft Releases SIwave v3 |
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Written by Tracy Heffner
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Thursday, 11 August 2005 |
PITTSBURGH – Ansoft Corp. has released SIwave v3, a full-wave electromagnetic-field simulator optimized for signal- and power-integrity analysis of high-performance printed circuit boards (PCBs) and integrated circuit packages. The new version reportedly provides expanded analysis capabilities for board and package co-design and EMI/EMC studies.
SIwave's finite-element technique allegedly allows designers to characterize simultaneous switching noise (SSN), inter-symbol interference (ISI), power and ground bounce, resonances, reflections and coupling between traces and power/ground planes across the package and through the board. With the inclusion of enhanced via modeling and package/board co-simulation, engineers are said to be able to more accurately characterize the entire PCB populated with IC packages.
It is said that far- and near-field data from SIwave can now be imported as a source driving HFSS v10, the industry-standard tool for 3D full-wave electromagnetic modeling.
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