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Zuken Participates in MESDIE Project
Written by Tracy Heffner
Friday, 15 July 2005
MUNICH, Germany and WESTFORD, MA – Zuken has been chosen as an EDA vendor representative to participate in a major multinational research project, MESDIE (microelectronic EMC system design for high density interconnect and high frequency environments).
The aim of MESDIE is to research modeling for new chip sets, dedicated HDI and package modules for applications facing EMC/noise and system integration in the telecommunications, automotive, consumer and multimedia sectors. MEDEA, the pan-European microelectronics research program, initiated the MESDIE project, which involved around 200 man-years over three years, ending in May 2005. By working in partnership with companies such as Airbus, Alcatel, Bosch, Infineon, Continental, Philips and ST-Microelectronics, the project has begun forming the basis of methods of modeling and simulation at the system design level.
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