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Ansoft Releases TPA v4.2
Written by Tracy Heffner
Friday, 15 July 2005
PITTSBURH, PA – Ansoft Corp. has released the Turbo Package Analyzer (TPA) v4.2. This version combines bi-directional integration with Synopsys' Encore package-design software with Ansoft's 3D electromagnetic simulation. It reportedly enables full parasitic extraction of complex IC packages.
"As a result of our close collaboration, Ansoft's advanced electromagnetic technology for package extraction and characterization can be accessed directly from our Encore product today," said Kevin Rinebold, Synopsys' senior technical marketing manager, Packaging Products. "Our work with Ansoft further advances the state of the art in package planning and design by integrating Ansoft's latest capabilities with our IC/Package co-design environment."
With AnsoftLinks, a tool for simplifying data import and export between EDA and CAD packages, TPA v4.2 will generate resistance, inductance and capacitance (RLC) models directly from popular package design tools. It allegedly accepts CAD data and fully characterizes the entire package in three dimensions. The 3D analysis provided by the TPA v4.2 extraction engine can reportedly solve any BGA package structure, including wirebonds, pads, vias, tapered traces, solder balls and non-ideal power and ground structures.
Other reported highlights include:
- RLC extraction via 3D field solvers - Ansoft's state-of-the-art 3D field-solver technology - fast Multipole Method for lumped parasitics - full package extraction via automatic partitioning - automatic partitioning via coupling length - power and ground plane inclusion - file export in Synopsys SNPS and SPEF formats - outputs RLC, SPICE, IBIS pkg - package layout support through AnsoftLinks for Cadence and Zuken
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