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Mentor Snares Global Siemens Deal
Written by Andy Shaughnessy
Thursday, 02 June 2005
WILSONVILLE, OR – Mentor Graphics Corp. signed a multi-year agreement to supply EDA tools to Siemens AG at more than 40 locations globally.
PCB tools purchased under the agreement include Board Station, Expedition, XtremePCB, ICX and DMS, as well as ModelSim, Precision Synthesis, Catapult C and the HDL Designer Series for ASIC and FPGA design, and the Seamless system design toolset.
"Mentor is pleased to work with Siemens on a worldwide basis," said Don Maulsby, senior vice president, World Trade at Mentor Graphics. "This new agreement increases our ability to provide design solutions for Siemens' business-critical applications, and enables Mentor to respond more quickly than ever to Siemens' rapidly changing design tool needs."
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CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com
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