You must be registered to access the full content of this site. To register, click here.
Part Search
SIA Reports Higher Global Chip Sales
Written by Mike Buetow
Friday, 01 October 2004
SAN JOSE, Sept. 30 - Worldwide sales of semiconductors grew to $18.2 billion in August, an increase of 1.1%over July, the Semiconductor Industry Association reported today. Meanwhile, IC makers are responding quickly to reports of excess inventories, SIA asserted.
Sales increased 34.2% from last August, in line with historical patterns.
"Semiconductor producers and their customers have reacted
with unprecedented speed to recent reports of excess chip inventories,"
said SIA president George Scalise, in a press statement. "In previous
market cycles, it has generally taken several quarters for the supply
chain to take corrective action. When the first reports of excess
inventory accumulation surfaced in the second quarter, both producers
and customers moved quickly to adjust.
A pair of research groups, VLSI Research and iSuppli, are now reporting that chip inventories are declining, Scalise said.
Capital spending at IC makers is about 23% of sales, in line
with historical patterns, SIA said. "At this time, we do not believe
overcapacity will be a major concern in 2005," SIA said.
SIA reiterated its forecast of 28% growth for 2004. Its 2005 industry forecast will be released Nov. 3.
Sales of PCs and equipment for networking and
telecommunications contributed to semiconductor growth in August. Sales
of microprocessors increased 3.5% sequentially, reflecting PC sales
patterns of the back-to-school season.
Chip sales were up modestly in all geographic regions. In
Asia-Pacific, sales increased just 0.1% sequentially, reflecting the
impact of inventory adjustment actions taken by OEMs, SIA said.
Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!
PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!
CSP/BallNest Socket Provides Consistant Test and Burn-In
Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping. It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides. It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings. www.arieselec.com