NEEDHAM, MA, Dec. 7, 2004 - The Product Development Company (PTC), today announced that the Defense Advanced Research Projects Agency (DARPA), the central research and development organization for the United States Department of Defense, has selected PTC as the prime contractor for a research project to deliver 3-Dimensional Integrated Circuit (3D IC) design management capabilities.

Reportedly, key to DARPA's decision was PTC's strong history of working with commercial and military electronics companies to improve their product development processes by producing higher quality, lower-cost products that can be delivered in a shorter timeframe.

As part of this multimillion dollar, multiyear funded research project, PTC has subcontracted with Raytheon and North Carolina State University. PTC and its partners plan to deliver three main components of the IC research project including design process management, design collaboration and design tool integration. Specifically, PTC will provide:

• Product development process management and design collaboration solutions developed with Windchill.
• Mechanical and thermal analysis of these next generation integrated circuits with Pro/ENGINEER.
• Information extraction and visualization with InterComm. 
• Integration to third-party design and analysis applications through Windchill.

As subcontractors to the deal, North Carolina State University will offer IC design technology expertise and Raytheon will provide key end-user perspective and testing.