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Xilinx Teams With Ansoft for High-Speed PCB and Backplane Design
Written by Tracy Heffner
Monday, 25 October 2004
SAN JOSE, Oct. 25, 2004 - Xilinx Inc. and Ansoft Corp.
announced a new Gigabit Interconnect Design Kit that allows customers
to perform extremely accurate "what if" analyses on high-speed PCB and
backplane designs.
Powered with Virtex-II Pro X series
FPGAs from Xilinx, the kit enables engineers to anticipate problems
early in the design phase and predict the quality of a signal, thereby
significantly minimizing lab debug times and costly board respins.
Xilinx teamed with Ansoft to provide
methods and guidelines for modeling high-speed interconnects. Accurate
electrical models that account for the physical effects have been
created for the Xilinx Virtex-II Pro X IC package, microstrip and
stripline transmission lines, connectors and circuit board via using
electromagnetic-field simulation.
The full channel response - from the
integrated circuit through the package, onto the board and out the
connector - was computed using Ansoft's Nexxim, DesignerSI and HFSS for
circuit, system and electromagnetic simulation.
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Development Kit Test Drives Innovative Cable Assemblies
3M introduces the Shielded Controlled Impedance (SCI) Cable Assembly Development Kit, 2mm. The development kit enables users to assess, test and design high-performance, 2mm SCI cable-to-board solutions. Engineers can attain multi-gigahertz performance from 2 mm printed circuit board connectors using 2mm shielded controlled impedance cable assemblies. The SCI connectors save board space without affecting performance. Users can verify signal integrity, impedance matching and crosstalk performance for designs requiring up to 1 Gbps single-ended performance per signal line or 5 Gbps differential performance per signal pair. The kit contains everything needed to assess, test and design, including a CD-ROM with application note, test instruction and technical sheets. www.3m.com