Home arrow News arrow Design News arrow Xilinx Teams With Ansoft for High-Speed PCB and Backplane Design
Part Search

NEW!
Find and quote components





Powered by


Terms Of Use

Xilinx Teams With Ansoft for High-Speed PCB and Backplane Design Print E-mail
Written by Tracy Heffner   
Monday, 25 October 2004

SAN JOSE, Oct. 25, 2004 - Xilinx Inc. and Ansoft Corp. announced a new Gigabit Interconnect Design Kit that allows customers to perform extremely accurate "what if" analyses on high-speed PCB and backplane designs.

Powered with Virtex-II Pro X series FPGAs from Xilinx, the kit enables engineers to anticipate problems early in the design phase and predict the quality of a signal, thereby significantly minimizing lab debug times and costly board respins.

Xilinx teamed with Ansoft to provide methods and guidelines for modeling high-speed interconnects. Accurate electrical models that account for the physical effects have been created for the Xilinx Virtex-II Pro X IC package, microstrip and stripline transmission lines, connectors and circuit board via using electromagnetic-field simulation.

The full channel response - from the integrated circuit through the package, onto the board and out the connector - was computed using Ansoft's Nexxim, DesignerSI and HFSS for circuit, system and electromagnetic simulation.


Comments
You are not authorized to leave comments. Please login first.


Sponsor Links

Free Product Evaluation:
Experience industry-leading PCB design tools, handling advanced technology designs. Reduce your design spins and increase manufacturing quality. Evaluate today!


Need PCB prototypes fast?
Sunstone Circuits takes the pain out of prototyping! We are dedicated to making the online ordering of PCB prototypes simple, fast, and easy from quote to delivery. Quick access to our 24/7/365 customer service team and easy online order tracking takes the pain out of sourcing prototypes online.
Put us to the test - order Sunstone Circuits today!


PCB systems design teams face challenges with IP management and collaboration across multiple groups. This free Webinar highlights best practices that optimize these efforts across the design flow. Learn more!

Classifieds


New Product
Development Kit Test Drives Innovative Cable Assemblies
3M introduces the Shielded Controlled Impedance (SCI) Cable Assembly Development Kit, 2mm. The development kit enables users to assess, test and design high-performance, 2mm SCI cable-to-board solutions. Engineers can attain multi-gigahertz performance from 2 mm printed circuit board connectors using 2mm shielded controlled impedance cable assemblies.
 
The SCI connectors save board space without affecting performance. Users can verify signal integrity, impedance matching and crosstalk performance for designs requiring up to 1 Gbps single-ended performance per signal line or 5 Gbps differential performance per signal pair.
 
The kit contains everything needed to assess, test and design, including a CD-ROM with application note, test instruction and technical sheets.
 
www.3m.com
Copyright © 2008 - This site contains copyrighted material that cannot be reproduced without permission.
Powered by Webtising